Средства разработки Bluetooth / 802.15.1 BOOST-CC2564MODA

Дочерняя плата , модуль CC2564 Bluetooth® с 2 режимами, встроенный модуль BoosterPack™ с антенной

The BOOST-CC2564MODA from Texas Instruments is a BoosterPack plug-in module. It is intended for evaluation and design purposes of dual mode Bluetooth CC2564 module with integrated antenna (CC2564MODA). The CC2564MODA module is based on TI's dual mode Bluetooth CC2564B controller which reduces design effort and enables fast time to market. The CC2564MODA module provides best-in-class RF performance with a transmit power and receive sensitivity that provides range of about 2X compared to other BLE only solutions. For a complete evaluation solution, the BOOST-CC2564MODA board plugs directly into TI LaunchPad development kits and BoosterPack plug-in modules such as MSP-EXP432P401R, CC3200AUDBOOST and CC31XXEMUBOOST. A certified and royalty free TI Bluetooth stack (TIBLUETOOTHSTACK-SDK) is available for the MSP430 and MSP432 MCUs. FCC, IC, CE certified with a certified and royalty free TI Bluetooth stack, getting started guide, demos and UART and PCM/I2S interface.

• Dual mode (Bluetooth & Bluetooth low energy) Bluetooth specification v4.1
• Integrated antenna on CC2564MODA  for ready to use application
• Class 1.5 transmit power (+10dBm) and high sensitivity (-93dBm typically)
• Four BoosterPack connectors (J1 through J4)
• Six jumper connectors (J5 through J10)

Области применения

Встроенные Конструкции и Разработка