Микросхемы и комплектующие 2821724-1

TE Connectivity IFP/LEC Assembly for use with Intel® Xeon® Phi™ Processor 7200F

Internal copper cable solution for use with Intel® Xeon® Phi™ Processor 7200F Series with integrated Intel® Omni-Path Architecture Supports 25Gbps channel speeds utilizing Intel Omni-Path Architecture Enables less expensive PCB material and electronics, with higher channel performance Optimized construction to minimize insertion loss and cross talk High density 0.7 mm LEC contact pitch 30AWG 85 Ohm low loss 25GHz primary pairs Toolless connector insertion and extraction Molded plastic strain-relief isolates solder joints from external stresses Straight, left-turn or right-turn exit LEC termination support different system designs Active press to release stainless steel IFT latching Torsional spring latch LEC termination connects to retention features on socket bolster plate Applications High performance computing Servers and routers Data Center and Enterprise networks