Микросхемы и комплектующие 2-382189-1

TE Connectivity 2.54mm Pitch Vertical 32 Way, Through Hole Stamped Pin Closed Frame IC Dip Socket, Гнездо

TE Connectivity DIPLOMATE Dual Leaf PCB Mount DIP SocketDIPLOMATE Dual Leaf (DL) DIP sockets with stamped and formed dual wiping contacts for vertical, through hole PCB mounting. These DIPLOMATE Dual Leaf (DL) DIP sockets have black thermoplastic GF stackable housings with a 2.54mm centreline, and a "true closed bottom" design which prevents solder or flux wicking and standoffs to allow board clearance for cleaning after soldering. The profiles for these DIPLOMATE Dual Leaf (DL) DIP sockets are all standard apart from part number 719-8817 which has an over-the-component profile. These DIPLOMATE DIP sockets are available with different frame styles with either straight or retention legs.